n-Link™ products include multi-protocol wireless SoC and modules for systems using high end host processors running Linux, Android or Windows operating systems. Read More
WiSeConnect™ & Connect-io-n™ products include multi-protocol wireless SoC and modules with embedded networking and wireless stacks/profiles. Read More
WiSeMCU™ products include multi-protocol wireless SoC and modules with an integrated Cortex-M4 processor for customer applications. Read More
FIPS-Connect™ is a FIPS 140-2 Level 1 certified dual band Wi-Fi module with integrated wireless stack, networking stack as well as several cryptographic algorithms. Read More
WAVECombo™ module provides 802.11p connectivity along with 802.11abgn and Bluetooth for V2X communication. . It enables dedicated short-range communications (DSRC) as well as non-DSRC applications.Read More
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Events
Booth #707, Hall 9 at China Information Technology Expo (CITE 2018), ShenZhen Convention & Exhibition Center
From 09-Apr-2018 To 11-Apr-2018
Hall E5, Booth #5130 at electronica China 2018, Shanghai New International Expo Center (SNIEC)
From 14-Mar-2018 To 16-Mar-2018
Indian Institute of Technology, Hyderabad
From 25-Feb-2018 To 28-Feb-2018
Booth #3-634, Hall 3, Nuremberg, Germany
From 27-Feb-2018 To 01-Mar-2018
Hyderabad International Convention Centre (HICC), Hyderabad, India.
From 18-Jan-2018 To 19-Jan-2018
Booth #P-27, Hall 4, Enova Paris Expo Porte de Versailles from September 19th - 21st, 2017
From 19-Sep-2017 To 21-Sep-2017
Booth #3-245, Exhibition Centre Nuremberg,
Germany
From 14-Mar-2017 To 16-Mar-2017
Booth #E5-5130, Shanghai New International Expo Center,
China
Booth #ET53A, BIEC, Bangalore,
INDIA
From 02-Mar-2017 To 04-Mar-2017
Hall #4, Booth #20, HYDERABAD INTERNATIONAL CONVENTION CENTRE,
From 07-Jan-2017 To 11-Jan-2017