Maxi-Fi® BEAM450™ – 3x3 802.11abgn Chipset


Maxi-Fi® BEAM450™ is Redpine Signals' 3-Spatial Stream dual-band 802.11n solution. This high-performance MIMO chipset solution includes RS9330 802.11n Baseband chip, interfacing to either the RS8330 (Dual-band MIMO Radio chip) or the RS8331 (Dual-band MIMO Radio chip with built-in High Power-amplifiers). The Maxi-Fi BEAM450 chipset provides low-cost CMOS integration of a high performance MAC, baseband processor, analog front-end, crystal oscillator, calibration EEPROM, dual-band RF transceiver and dual-band high-power amplifiers (RS8331 only), thus providing a cost-effective solution targeting high throughput and high QoS wireless applications.

The Maxi-Fi BEAM450 is the industry's first 802.11n solution to support "Software configurable simultaneous dual-band". This patent pending feature provides system integrators the capability to re-configure the MIMO chipset on-the-fly from a 3-Spatial Stream 450Mbps 3x3 system (working in either 2.4GHz or 5GHz ISM bands) into a Simultaneous dual-band system with 150Mbps in one band and 300Mbps in the other band. Simultaneous dualband enables robust QoS provisioning for demanding video applications in crowded wireless environments, and the icing on the cake is that Maxi-Fi BEAM450 provides this at zero cost and power overhead to the system. Redpine also provides TURBO900™ and TURBO1350™ reference designs which use two or three RS9330 chips respectively. These designs provide physical layer throughputs of 900Mbps and 1.35Gbps on a "single" PCI-e host interface, thus addressing the performance requirements of today's most demanding wireless video applications


  • High-Performance 3 Tx – 3 Rx Dual-band 802.11n , dynamically scaled down to 1Tx – 1Rx using MIMO Power-save
  • 450 Mbps data-rate using 3-Spatial Stream 802.11n MCS-23 for high user throughput
  • Leverages Redpine's Patent Pending ML MIMO decoder for optimal receiver performance
  • On-the-fly "Software Configurable" Simultaneous dual band – Patent Pending
  • Supports 10/20/40 MHz operation
  • "Host and Application Agnostic" Chip cascading in TURBO900™ and TURBO1350™ reference designs. Provides 900Mbps and 1.35 Gbps PHY throughputs using 80MHz and 120MHz bandwidths respectively – on a single PCI-e host interface
  • Hardware Assisted Radar-detection for compliance to FCC and ETSI norms, enabling usage of more channels in the 5GHz band
  • Supports 802.11n Advanced Transmit Beamforming (Implicit and Explicit) for increased throughput robustness.
  • Integrated ThreadArch® Four-threaded processor with on chip memory for low-host overhead and customer specific differentiations
  • On-chip DMA with scatter gather support for maximizing the effective throughput for a given data-rate
  • Supports IPSec and TCP Checksum host-offloading
  • High level of CMOS integration to minimize RBOM (E.g., On-chip OTP, Crystal Oscillator and High Power Amplifiers)
  • Rich set of Peripheral and host interfaces to allow maximum flexibility for the system integrator. Host interfaces include PCIe, PCI, USB 2.0 and SDIO.
  • System Diagram
  • Applications
  • Specifications
  • Software Package

System Diagram


  • High Performance Laptops
  • Wireless Routers
  • Access Points
  • Storage Devices
  • Broadband Access Modems
  • Set-top Boxes
  • HDTVs
  • Blu-ray Players, etc


  • IEEE 802.11a/b/g/j, 802.11n, 802.11e/i/w, 802.1X, 802.11k, 802.11h
  • 802.11n: from 6.5 Mbps to 450 Mbps
    802.11a/g: from 6 Mbps to 54 Mbps
    802.11b: from 1 Mbps to 11 Mbps
    TURBO900™ Ref. Design: Up to 900Mbps
    TURBO1350™ Ref. Design: Up to 1.35Gbps
  • OFDM with BPSK, QPSK, 16-QAM, and 64-QAM 802.11b with CCK and DSSS
  • WMM and WMM Power Save Support
  • 802.11i:AES, TKIP, WPA2, WPS, WPSE WAPI
  • MCS0-7, MCS8-15, MCS16-23, MCS32, MCS33-38, and MCS39-52
    3 spatial stream MIMO;
    On-the-fly Software configurable Simultaneous Dual-band (3x3 can be configured as 2x2 + 1x1)
    1 spatial stream STBC, RIFS, Beamforming (Implicit and Explicit), Greenfield Preamble, Short-GI
    A-MPDU, A-MSDU Aggregation with Block-ack, PSMP, MTBA
  • USB 2.0, PCIe, PCI, SDIO
  • 1.2V ± 10%, 3.3V ± 10%
  • Industrial Grade -40ºC to +85ºC
  • WiFi Alliance (802.11abgn, WPA, WPA2, WMM, WMM Power-save, WPS, Wi-Fi Direct™)
    World-Wide Regulatory Compliance

Software Package

The Maxi-Fi® BEAM450 chipset is accompanied by Redpine's OneBox™ software framework with DirectLINQ™. OneBox™ supports Access Point, Station and Wi-Fi Direct™ functionality on a variety of host platforms and operating systems. The software package includes complete MAC firmware, reference drivers and configuration graphical user interface (GUI) for Linux and Windows families.