RS13100 Wireless MCU SoCs & Modules

3.51 mm X 3.60 mm
More Footprints
Redpine Signals' RS13100 WiSeMCU family of SoCs and modules provides ultra-low power dual-mode Bluetooth®5, 802.15.4 and up to 180 MHz ARM®Cortex®-M4F application processor with advanced security and a rich set of digital/analog peripherals. The RS13100 provides the necessary wireless connectivity options and processing power for audio, data transfer, locationing and control/monitoring applications for wearable, home automation, industrial automation, lighting and home appliance markets.

Solution Highlights

  • Highly integrated and secure solution with dual-mode Bluetooth 5 and 802.15.4 (capable of running ZigBee or Thread)
  • Efficient on-chip application processor based on ARM® Cortex®-M4F with up to 180 MHz performance, up to 4 MB dedicated flash and up to 272 kB of RAM
  • Support for BLE 5 long range (125 kbps), high data rate (2 Mbps) and advertising extensions
  • Ultra-low power consumption with multiple power modes to reduce the system energy consumption
  • Multiple levels of security including PUF (Physically Unclonable Function), Crypto HW accelerators, Secure Bootloader and Secure Zone, to create a highly secure system
  • Ultra-small size SoC (3.51 mm x 3.6 mm) and module (4.63 mm x 7.90 mm) options (additional package options are also available)
  • Integrated wireless stacks and profiles for easy evaluation and integration
  • Leading edge RF performance (up to 20 dBm output power for BLE and 802.15.4) providing long range up and higher throughputs
  • Unique peripherals like ULP sub-system, Voice Activity Detection (VAD) and up to 8 capacitive touch sensor inputs

Block diagram

  • ARM® Cortex®-M4 core with up to 180 MHz
  • Integrated FPU, MPU and NVIC
  • SWD and JTAG debug options
  • Internal and external oscillators with PLLs
  • Flash In-Application Programming (IAP), In-System Programming (ISP) and Over-the-Air Wireless Firmware Upgrade
  • Power-On Reset (POR), Brown-Out and Black-out Detect (BOD) with separate thresholds
  • Up to 4 MB integrated Quad-SPI flash with inline AES engine and XIP
  • Up to 272 KB SRAM
  • 4-way set-associative 16 KB I-Cache
  • HW device identity and key storage with PUF
  • Trusted Execution Environment with Secure Boot loader
  • Accelerators: AES128/256, SHA256/384/512, RSA, ECC, ECDH, RNG, CRC
  • Compliant to dual-mode Bluetooth 5
  • Transmit power up to +20 dBm1 for Bluetooth LE with integrated PA
  • Transmit power up to +15 dBm1 for Bluetooth EDR with integrated PA
  • Receive sensitivity as low as -104 dBm1
  • Data rates: 125 kbps, 500 kbps, 1 Mbps, 2Mbps, 3 Mbps
  • EDR+2.1, 4.0, 4.1, 4.2 and 5.0
  • BT LE 1 Mbps, 2 Mbps and Long Range modes
  • Piconet and scatternet
  • BT profile support2 for SPP, A2DP, AVRCP, HFP, PBAP, IAP, GAP, SDP, L2CAP, RFCOMM, GATT, IAP1, IAP2
  • Compliant to IEEE 802.15.4, 2.4 GHz
  • Transmit power up to +20 dBm1 with integrated PA
  • Receiver sensitivity of -102 dBm1
  • ZigBee PRO and Thread stack embedded
  • Supported modes2: ZigBee Coordinator, Router1, End device
  • Supported profiles2: Zigbee Light Link (ZLL), Home Automation (HA) and Smart Energy (SEP)
  • Supported Thread modes2: Border Router, Router, End Device
RF Features
  • Integrated baseband processor with calibration memory, RF transceiver, high-power amplifier, balun, T/R switch and flash memory (module)
MCU Sub-system Power Consumption
  • Active current as low as 19uA/MHz1 in low power mode
  • Deep sleep mode current: ~500nA1
  • Dynamic Voltage & Frequency Scaling
  • Deep sleep mode with only timer active - with and without RAM retention
Wireless Sub-system Power Consumption
  • 7.7 mA1 transmit current in BT 5 mode, 0 dBm output power, 1 Mbps data rate
  • 15 uA1 in BT 5 Connected mode (1s connection interval, 0dBm, 0byte)
  • 10.2 mA1 receive current in BT 5 mode, 1Mbps data rate
Digital Peripherals
  • USB HS OTG with integrated HS transceiver
  • 10/100 Mbps Ethernet MAC with RMII
  • SDIO 3.0 host and slave, SD/eMMC
  • 3x USART, 4x SPI, 3x I2C, 2x I2S, SIO, CAN 2.0B
  • Timers: 5x 32-bit, 1x 16/32-bit, 1x 24-bit, WWDT, RTC, RIT, QEI
  • Up to 85 GPIOs with GPIO multiplexer
Analog Peripherals
  • 12-bit 16-ch, 5 Msps ADC, 10-bit DAC
  • 3x op-amps, 2x Comparators and Temperature Sensor
  • 8 capacitive touch sensor inputs
  • Voice Activity Detection (VAD)
Software and Regulatory Certification
  • ZigBee Certification2, Bluetooth Qualification2
  • Regulatory certifications (FCC, IC, CE, ETSI, TELEC)2
Operating Conditions
  • Single supply: 2.1 to 3.6V or 1.85V
  • Operating temperature: -40°C to +85°C (Industrial grade)
  • LGA module
  • SoC packages - WLCSP, QFN and BGA
Evaluation Kit
  • RS13100-EVK1
Package Code Package Type Dimensions (mm) Frequency Band Integrated Antenna
B00 LGA,126 4.63 x 7.9 x 1.2 Single Band (2.4 GHz) No
Package Code Type of Package Dimensions, Pitch (mm) Frequency Band
WMS WLCSP, 79 3.51 x 3.6 x 0.5, 0.4 Single Band (2.4 GHz)
QMS QFN, 84 7 x 7 x 0.85, 0.5 Single Band (2.4 GHz)
BTS BGA, 196 6 x 6.3 x 0.9,0.5 Single Band (2.4 GHz)

Part Number Wireless CPU Frequency Flash+RAM SoC Packages (ppg) Module Packages (ppg)
RS13100-0BT0-140F-ppg BT5 + 802.15.4 100 MHz 4 MB + 272 kB BTS -
RS13100-0BT0-240F-ppg BT5 + 802.15.4 180 MHz 4 MB + 272 kB BTS -
RS13100-0BT0-110F-ppg BT5 + 802.15.4 100 MHz 1 MB + 272 kB QMS B00
RS13100-0BT0-210F-ppg BT5 + 802.15.4 180 MHz 1 MB + 272 kB QMS B00
RS13100-0BT0-1N0F-ppg BT5 + 802.15.4 100 MHz 0 MB + 272 kB QMS, WMS B00
RS13100-0BT0-2N0F-ppg BT5 + 802.15.4 180 MHz 0 MB + 272 kB QMS, WMS B00

Notes: Replace 'ppg' with desired SoC / Module Packages code


SoC Packages

3.51 mm X 3.60 mm

6 mm x 6.3 mm

7 mm x 7 mm
Module Package

LGA Module (B00)
4.63 mm X 7.90 mm

1: Subject to change. Contact Redpine Signals for final numbers.
2:Contact Redpine for availability