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  • ABOUT US
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  • PRODUCTS
    • Product Selection Guide
    • Wi-Fi Chipsets
      • Low power 802.11abgn SDIO/SPI
      • 802.11bgn PCI
      • 802.11bgn SDIO/SPI
      • 802.11abgn 3x3 SDIO/PCIe/PCI/USB
    • Wi-Fi-Modules
      • n-Link™
        • 802.11bgn (2.4GHz) Module
        • 802.11abgn (2.4/5GHz) Module
      • Connect-io-n™
      • WiSeConnect™
    • Wi-Fi-Systems
      • Find-IT™
        • RS9110-N-11-61
    • Wi-Fi Starter Kits
      • Atmel MCU Kits
      • Renesas MCU Kits
      • Cypress MCU Kits
      • Freescale MCU Kits
  • SOLUTIONS
    • Wi-Fi Design Center
      • Interfaces
      • Microcontroller
      • Operating System
      • Why 11n?
      • Embedded Wi-Fi - What is it?
      • Myth - Performance Vs. Power
    • Reference Designs
      • Sensor Networks
        • 802.11n Wi-Fi Sensor Module
      • Voice over Wi-Fi
        • 802.11n VoWiFi Reference Design
      • Smartgrid Communicaions
        • Advanced Metering Gateway System
        • Low-PowerMetering and Communications Module
        • Secure Circuit Breaker System
        • Long-Range Simultaneous Dual-band Wi-Fi Module
    • Wi-Fi Applications
      • Mobile Phone
      • VoWi-Fi Phone
      • Wireless Sensor Node
      • Wi-Fi RTLS Tag
      • Serial to Wi-Fi Interface
      • Wireless Mouse
      • Medical Applications
      • Wireless Remote Control
      • Mobile Internet Device
      • Portable Navigation Device
      • Mobile Gaming Device
      • IP Camera
      • Personal Media Player (PMP)
      • Digital Camera
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  • CONTACT US
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Smartphone, E-book Reader, Media Player, Headsets

Wireless Router, Access Point, Cellular Gateway

Laptop, Tablet PC, Wireless Peripherals

Wireless Displays, Gaming Consoles, Smart Appliances, Smart Meter

Building Automation, POS Terminals, Wireless Sensors, Lighting Control, Medical

Conferencing Systems, Security Systems, VoWiFi Phones


  • Chipsets
  • SiP Modules
  • M2M Kits
  • Lite-Fi® - Ultra low power, 1x1, dual band, 802.11n Wi-Fi Chipset
  • Maxi-Fi® BEAM450™ - 3x3, 450Mbps, Simultaneous dual band, 802.11n Wi-Fi Chipset
  • n-Link™ - 802.11bgn module (RS9110-N-11-02)
  • n-Link™ - 802.11abgn module (RS9110-N-11-03)
  • Connect-io-n™ - 802.11abgn modules with integrated TCP/IP stack
  • WiSeConnect™ - Advanced 802.11abgn modules with Wi-Fi Direct™ and Enterprise Security
  • Atmel MCU Kits with 802.11n Wi-Fi Modules
  • Cypress PSoC Kits with 802.11n Wi-Fi Modules
  • Renesas MCU Kits with 802.11n Wi-Fi Modules
  • Freescale MCU Kits with 802.11n Wi-Fi Modules
  • Technology
  • Industry First
  • Patents
  • Offerings
  • ThreadArch®- Low power Multi-thread Processor Architecture (2003)
  • Low power Wi-Fi - 802.11abg (2005)
  • Low power Wi-Fi - 802.11abgn (2007)
  • Low power wireless convergence, MIMO 802.11n + 802.16e (2008)
  • Low power 802.11n based Wi-Fi tag for RTLS (2009)
  • High performance simultaneous dual-band MIMO 802.11n Wi-Fi (2010)
  • Low power VHT Wi-Fi - 802.11ac (2011)
    Redpine has focused on innovation through research in areas that include OFDM/OFDMA, MIMO, energy efficient wireless, wireless operation in dense environments, low power CMOS RF and high efficiency CMOS PAs.

    Redpine's patent portfolio includes 41 awarded patents and over 100 in the pipeline.
    Wi-Fi® technology (MAC, Baseband, CMOS RF, CMOS PA, Certified software stack) for 802.11abgn/ac single stream to 3-stream MIMO.
    • Low power 802.11abgn technology for battery powered applications
    • Low power 802.11abgn/ac for combo chips and smartphone application processors
    • Low power AND high performance 802.11abgn/ac for networking market
  • Press Releases
  • Applications
  • Design
  • Support
  • Buy Now
  • January 18, 2012: Redpine Signals Announces Industry's First Full-Featured and Self-Contained Low-Power 802.11n Wi-Fi Module for M2M Markets
  • January 17, 2012: Redpine Signals Expands Sales and Support Infrastructure through Partnership with CEL
  • December 14, 2011: Redpine Signals Releases First Ultra Low Power 802.11ac Technology for Smartphone Application Processors
  • October 25, 2011: Micrium and Redpine Partner to Offer Support for Redpine's Embedded Wi-Fi Solutions on Micrium's uC/TCP-IP Stack
  • October 24, 2011: Redpine Signals and Grid2Home Partner to Offer SEP 2.0 Profile over 802.11n Wi-Fi
  • Why 11n?
  • Embedded Wi-Fi - What is it?
  • Myth - Performance vs. Power
  • Getting Started
        Interfaces
        Microcontrollers
        Operating Systems
  • Technical Articles
  • White Papers
  • Design Partners

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  • Advanced 802.11n Module for M2M Market

    Full-Featured 802.11n module with Wi-Fi Direct™, Enterprise Security and SEP 2.0 support.
    Read More ...

  • EDN Hot 100 Products of 2011

    Redpine Signals "Wi-Fi Module with Atmel MCU Support" recognized as one of EDN's Hot 100 Products of 2011.

    Learn more...

  • Redpine Disrupting the Wireless Industry

    Learn more...

  • Redpine at Arrow M2M Seminar Series

    Venkat Mattela, Redpine Signals' CEO, will present a seminar on "Wi-Fi® Connectivity Role in M2M Communications" and participate in panel discussions with several other industry experts.
    Learn more...

  • Redpine Releases Low Power 11ac Technology

    Redpine's new Quali-Fi™ 802.11ac implementation delivers high throughput Wi-Fi links on mobile devices under adverse RF environments
    Learn more...

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