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Chipsets |
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Wi-Fi Modules |
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Wi-Fi-Systems |
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Wireless Silicon Cores |
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» Chipsets
and Modules |
| Chipsets and
Modules |
Chipsets
Redpine’s Lite-Fi® family of ultra low power Wi-Fi® processors provides unprecedented power profiles for 802.11n. The RS9110 is Redpine’s third generation low power product addressing the mobile and portable markets.
The RS9110 uses advanced system-level power management techniques and to reduce power significantly. The RS9110 is packaged in WLCSP and UFLGA. The WLCSP device (0.35mm thickness) enables Micro SD and SiP 802.11n modules for the mobile market.
Redpine's Maxi-Fi® family of high performance single chip 802.11b/g/n SoC chipsets cater to the higher-throughput PC and Access Point market segments. They incorporate Redpine’s fourth-generation 802.11 technology, leveraging our vast WLAN patent-portfolio developed over the past eight years, and stand out in wireless performance in adverse environments. The products include the RS9115 2.4 GHz chip with PCI interface, the RS9116 2.4 GHz chip with SDIO and SPI interfaces, the RS9117 dual-band 2.4/5 GHz chip with SDIO and SPI interfaces, and the RS9118 dual-band 2.4/5 GHz chip with PCI, SDIO and SPI interfaces. The Maxi-Fi® BEAM150™ device family complements Redpine Signals’ highly successful ultra-low power 802.11n Lite-Fi® device family. |
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Modules
Redpine's module products are carefully architected to
present optimal solutions to a variety of applications.
These modules integrate the 802.11n MAC/BBP, RF,
configuration flash, and other required components,
resulting in a very low BOM. Separate solutions address
varied application-specific requirements; and the modules
include a low cost and an ultra-low form factor SDIO/SPI
based WLAN client, and a dual-band SDIO/SPI WLAN client.
The n-Link products are targetted for high througput
applications with medium or high capacity host processor,
while the Connect-io-n modules address the needs of the
embedded systems market built around a variety
of microcontrollers of all types. |
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| Connect-io-n™
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The Connect-io-n(TM) products are highly integrated single stream 802.11n modules designed to provide future-proof 'plug-and-play' Wi-Fi connectivity to embedded devices. They all feature standard serial or SPI interfaces to a host microcontroller and include all the functionality required in a WLAN client. Some of the products also include a full networking stack running on the embedded processor within Redpine's chipset, enabling network connectivity into numerous existing embedded systems with no additional burden on their microcontrollers. The Connect-io-n series includes variants offering single or dual-band operation, choice of form-factor, and options in software architecture.
The table below may be used to arrive at the optimum product for a desired application.
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| *Includes antenna and frequency reference. With an option for a connector for external antenna. |
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| Wireless Silicon Cores |
| Design and development of high-performance and ultra-low
power
wireless sytems requires a high degree of innovation and the
design
maturity arising from multiple generations of product
experience, p
roven silicon and deployed-solutions. Having invested more
than
600 man-years in advanced 802.11n, 802.16e and
next-generation LTE
technologies and having 100+ US patents filed in these
areas, Redpine
has the right technology and solutions for system designers
and SoC
architects faced with the "wireless integration challenge."
Redpine's portfolio of Wireless IP arises from this
experience, and
include the silicon core as well as the software critical
for high
performance and interoperable operation. |
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